FREEDM Tech Webinar Series: A New Technique for HV Electric Field Analysis and E-Field Profiling in Layered Packaging
Power modules often fail at triple points where three materials come together and partial discharge can age the insulation. This presentation proposes a capacitive modeling method to reveal techniques to reduce the electric field intensity that were not previously obvious. Accounting for both parallel plate capacitance and fringing field effects, the model is verified through…