• Power Electronics Applications Using Wide Band-Gap Semiconductors

    FREEDM Systems Center and PowerAmerica will host a presentation by Dr. Andy Lemmon, Ph.D., P.E., titled Modeling & Characterization of Electro-Magnetic Interference in Power Electronics Applications Utilizing Wide Band-Gap Semiconductors. View the presentation abstract and Dr. Lemmon's Bio. This is a free event.

  • IEEE PES T&D Conference 2018

    Denver Denver, CO, United States

    The 2018 IEEE PES T&D Conference & Exposition is coming to Denver April 16-19, bringing more than six decades of industry innovation to our biggest and most exciting conference yet. This landmark event will showcase the solutions, technologies, products, companies, and minds that will lead our industry to the next generation power systems. The theme of…

  • 2018 State Energy Conference of North Carolina

    McKimmon Conference Center 1101 Gorman St, Raleigh, NC, United States

    The 2018 State Energy Conference of North Carolina will be held April 17-18 at the McKimmon Conference and Training Center in Raleigh, NC.  The conference provides actionable insight into the business of energy, connecting technical innovation, diverse resources, and industry opportunity to help drive North Carolina's regional energy economy forward with national impact. Conference tracks…

  • FREEDM Annual Conference

    McKimmon Conference Center 1101 Gorman St, Raleigh, NC, United States

    Please join FREEDM Systems Center as we celebrate our 10th year. The Annual Conference will showcase the achievements of the last 10 years through keynote speakers and presentations from faculty and industry members that will give insight into FREEDM's role in shaping the energy industry and its future. Open to the public, tickets are $50…

  • International Symposium on 3D Power Electronics Integration and Manufacturing

    Adele H. Stamp Student Union, University of Maryland, College Park, MD USA MD, United States

    This symposium, to be held at the University of Maryland, College Park will bring together world-class experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems.  The focus will be on additive, embedded, co-designed, and integrative packaging technologies and the symposium will emphasize the need to address…